Our Smart Megasonix is the industry's most advanced cleaning technology, which achieves thorough, comprehensive cleaning evenly across the wafer and without damage to device features. These proprietary new ACM technologies are able to precisely control both the power intensity and the distribution of megasonic cleaning - with dramatically positive effect.
ACM's proprietary Space Alternated Phase Shift (SAPS) technology employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned water surfaces in highly uniform manner on a microscopic level. This enables it to remove random defects across an entire wafer much more efficiently than conventional jet-spray processes.
For advanced wafer cleaning systems, ACM's Timely Energized Bubble Oscillation (TEBO) technology provides efficient, damage-free cleaning of 2D patterned chips and 3D structures such as FinFET, DRAM, 3D NAND, and 3D cross-point memory, even devices with very high aspect ratios. It enables precise, multi-parameter control of bubble cavitation during megasonic cleaning.
ACM's proprietary Space Alternated Phase Shift (SAPS) technology employs alternating phases of megasonic waves to deliver megasonic energy to flat and patterned water surfaces in highly uniform manner on a microscopic level. This enables it to remove random defects across an entire wafer much more efficiently than conventional jet-spray processes.
For advanced wafer cleaning systems, ACM's Timely Energized Bubble Oscillation (TEBO) technology provides efficient, damage-free cleaning of 2D patterned chips and 3D structures such as FinFET, DRAM, 3D NAND, and 3D cross-point memory, even devices with very high aspect ratios. It enables precise, multi-parameter control of bubble cavitation during megasonic cleaning.
Services
Founded in 1998 in Silicon Valley, ACM Research, Inc. develops wet processing technology and products for the semiconductor and wafer level packaging (WLP) industries.
The company has produced equipment for a range of applications in IC manufacturing and WLP-with a special focus on cleaning technologies for advanced semiconductor devices.
ACM now has complete R&D, engineering and manufacturing operations at its Zhangjiang High-Tech Park facility in Shanghai, China.
In addition, advanced service coverage has also been positioned at strategic locations around the globe, including Beijing, Taiwan, Korea, and the U.S., to provide world-class support for customers worldwide.
The company has produced equipment for a range of applications in IC manufacturing and WLP-with a special focus on cleaning technologies for advanced semiconductor devices.
ACM now has complete R&D, engineering and manufacturing operations at its Zhangjiang High-Tech Park facility in Shanghai, China.
In addition, advanced service coverage has also been positioned at strategic locations around the globe, including Beijing, Taiwan, Korea, and the U.S., to provide world-class support for customers worldwide.
Traditional megasonic wafer cleaning has reached its limits.
The conventional cleaning methods are no longer able to remove the smallest killer defects without causing device damage.
This is why ACM has developed Smart Megasonix-a smarter, more innovative suite of single wafer wet cleaning technologies that can be used at existing and future process nodes across the range of processing steps-to achieve more thorough, comprehensive cleaning without damage to device features.
These proprietary ACM technologies are able to control both the power intensity and the distribution of megasonic cleaning-to achieve dramatically positive results.
The conventional cleaning methods are no longer able to remove the smallest killer defects without causing device damage.
This is why ACM has developed Smart Megasonix-a smarter, more innovative suite of single wafer wet cleaning technologies that can be used at existing and future process nodes across the range of processing steps-to achieve more thorough, comprehensive cleaning without damage to device features.
These proprietary ACM technologies are able to control both the power intensity and the distribution of megasonic cleaning-to achieve dramatically positive results.
For removing the smallest defects without damage-even delicate 3D structures with very high aspect ratios.
Traditional megasonic cleaning has reached its limits.
The conventional cleaning methods are no longer able to remove the smallest killer defects without causing device damage.
This is why ACM has developed Smart Megasonix-a smarter, more innovative suite of single-wafer wet cleaning technologies that can be used at existing and future process nodes across the range of processing steps-to achieve more thorough, comprehensive cleaning without damage to device features.
Traditional megasonic cleaning has reached its limits.
The conventional cleaning methods are no longer able to remove the smallest killer defects without causing device damage.
This is why ACM has developed Smart Megasonix-a smarter, more innovative suite of single-wafer wet cleaning technologies that can be used at existing and future process nodes across the range of processing steps-to achieve more thorough, comprehensive cleaning without damage to device features.
The Ultra C b backside cleaning tool from ACM Research is designed for 200mm or 300mm wafers' backside clean or etch processes widely used in IC wafer manufacturing, wafer level packaging and the power device industry.
It uses a contactless Bernoulli wafer chuck to prevent the frontside of the wafer from damage.
When chemical solutions are dispensed onto the wafer backside, the device side is protected from chemical solutions or vapors via nitrogen (N2) gas delivered from the Bernoulli chuck.
The Ultra C b system delivers effective particle performance and etch uniformity, while meeting undercut requirements on the wafer bevel and pin mark-free control.
It uses a contactless Bernoulli wafer chuck to prevent the frontside of the wafer from damage.
When chemical solutions are dispensed onto the wafer backside, the device side is protected from chemical solutions or vapors via nitrogen (N2) gas delivered from the Bernoulli chuck.
The Ultra C b system delivers effective particle performance and etch uniformity, while meeting undercut requirements on the wafer bevel and pin mark-free control.
ACM Research's Ultra C s scrubber tool expands the company's scrubber capabilities, proven for wafer-level packaging (WLP), to IC foundry processing.
With its advanced dual-fluid spray-cleaning technique using gentle nitrogen gas (N2) spray, backside brush and bevel brush, using a precise pressure control system, the tool provides high-efficiency particle removal and scratch-free cleaning of the wafer frontside, backside and bevel.
It can also be optionally equipped with ACM's patented SAPS megasonic technology for more intense cleaning and removal of smaller particles.
With its advanced dual-fluid spray-cleaning technique using gentle nitrogen gas (N2) spray, backside brush and bevel brush, using a precise pressure control system, the tool provides high-efficiency particle removal and scratch-free cleaning of the wafer frontside, backside and bevel.
It can also be optionally equipped with ACM's patented SAPS megasonic technology for more intense cleaning and removal of smaller particles.
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